Loading the content... Loading depends on your connection speed!

the csp package in fluorescent led tube light replacements applications is easier to implement based on flip-chip technology

Most of the current light source enterprises in the production of CSP devices, and more will be used flip-chip package. The use of this package, the more common flip-chip device can enhance the efficiency of 10% -15%, while also meeting the requirements of chip-scale package.

the csp package in fluorescent led tube light replacements applications is easier to implement based on flip-chip technology

In fact, the concept of CSP, originally proposed by the chip companies.If its basic meaning, it is necessary to remove the substrate part, but the combination of existing packaging technology to consider, then remove the substrate part of the temporary can not operate. Guangzhou Hongli Photoelectric Co., Ltd. Product Director Wang Gaoyang told reporters.
In this case,

Therefore, the current majority of the light source enterprises in the production of CSP devices, and more will be used flip-chip package. The use of this package, the more common flip-chip device can enhance the efficiency of 10% -15%, while also meeting the requirements of chip-scale package. Therefore, the existing CSP package in fluorescent led tube light replacements applications is based on flip-chip technology exists.
In this case,

“In many of the existing packaging, only flip-chip technology can make CSP packaging easier to implement.” Fujian Wanban. Executive Vice President Dr. Liu Guoxu told reporters that the traditional formal and vertical structure in the Implementation of the CSP package in fluorescent led tube light replacements applications will encounter many difficulties, and flip-chip technology to solve this problem timely.
In this case,

“Because if you are using a vertical or vertical structure, which must ensure that there must be openings on the way, this package will expose the electrode, resulting in its white encapsulation, the process of coating the phosphor will encounter many challenges. If the flip – chip structure, the electrodes are in the bottom, do not need to do any lead, you can put a whole piece of phosphor, fluorescent coated up, so once in place, thus greatly reducing the difficulty of CSP packaging process. Liu Guoxu explained.

Leave a Comment