led packaging equipment improved power
Currently, the packaging manufacturers use the following two methods: one is the use of gold-tin alloy eutectic, direct bonding of welding (hereinafter referred to as “alloy welding”); the other is the use of additional flux (mainly For the paste) over-reflow eutectic way (hereinafter referred to as “reflow”).In this case,Cui Tao automation related personnel, in the alloy used for traditional semiconductor eutectic alloy process, the need for high-temperature and ultrasonic closely, and the need for reliable welding to achieve the flip-chip in fluorescent led tube lights alloy welding work. However, at present, the technical system of this equipment is obviously not mature, and the cost is high, at present our apparatus can not be competent to flip the technical requirement of capsulating too.In this case,According to report, the welding technology in the 300-degree heat environment to complete, the packaging method is completely different from the traditional solid crystal approach, leading to the current domestic equipment manufacturers introduced flip equipment are unsatisfactory. According to report, now on the market for flip-chip in fluorescent led tube lights alloy welding process is mostly foreign equipment, domestic equipment manufacturers in eutectic alloy welding there are still some technical threshold.In this case,Jack Xiao, general manager of Wanban said, “flip-chip in fluorescent led tube lights changes in the way, coupled with a variety of flip-chip in fluorescent led tube lights technology in the form, making the flip-chip in fluorescent led tube lights packaging equipment manufacturers need different requirements in the short term to meet this demand is unlikely” .
In this case,>At the same time, with the LED packaging device prices fell sharply, corporate gross margin continued to fall, but also for many enterprises in the new equipment investment on a conservative attitude, especially in the import of high-priced equipment, immature domestic equipment industry background, Abnormal caution. In addition, some enterprises prefer the second choice, domestic equipment or in the existing equipment for improvement.In this case,Reporters learned that, for the use of solder paste over reflow soldering the way for the technology, most companies choose to install the existing packaging equipment to be improved, so that packaging manufacturers to achieve the basic flip-chip in fluorescent led tube lights technology needs. If the original equipment from 15K hour or 20K hour, adjusted to 10 K hour, the speed slowed down, high precision to meet the needs of flip.“At present, many companies, including ourselves, are using flip-chip in fluorescent led tube lights devices that have been modified for pastes that have been reflowed with solder paste, although there may be a small hole in the middle of the chip, which is not necessarily the case,” said Yeh Kye-kay, Fully able to fill, but this does not affect the overall thermal performance of the device, the product yield and quality can be guaranteed.