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led flip chip bonding technology

LED packaging technology to create a new era

It is reported that LED flip chip bonding process is mature in the field of LED packaging to form a new technology line, is a major technological breakthrough, to fill the domestic LED flip chip bonding process blank, the application of this technology will be large Scale alternative bonding technology is to achieve the upgrading of LED packaging technology.

Commissioned by the Ministry of Science and International Cooperation Department, recently, the provincial Science and Technology Department of the experts on the wanban bear the “LED flip chip bonding technology joint research and development” for acceptance. By reviewing the project technical information, on-site inspection, questioning and other procedures, the project has been highly praised both inside and outside the province of technical experts.

The International Science and Technology Cooperation Project cooperated with Nipponbashi Manufacturing Co., Ltd. to study the key technologies of LED chip flip-chip bonding technology, high-performance heat-dissipating substrate and anisotropic conductive adhesive preparation, and developed LED flip-chip adhesive The COB light source with LED flip-chip encapsulation process can accommodate more than 30% more chips than the COB light source in the same package.

led flip chip bonding technology

The total luminous flux is increased by more than 50%. The thermal conductivity coefficient of the special substrate is up to 386 W mK, greatly improving the thermal performance. Project to overcome the LED flip chip bonding and many other technical problems, the establishment of a stable and effective cooperation mechanism in the enterprise formed a stable R & D team. Effective solution to the existing domestic LED mounted chip packaging technology, poor thermal conductivity, poor conductivity, the light efficiency is low, poor reliability, the unit area can be packaged less the number of chips and other technical problems.

It is reported that LED flip chip bonding process is mature in the field of LED packaging to form a new technology line, is a major technological breakthrough, to fill the domestic LED flip chip bonding process blank, the application of this technology will be large Scale alternative bonding technology is to achieve the upgrading of LED packaging technology.

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